October 07, 2020
Taiwan Semiconductor Manufacturing Company Limited (“TSMC”), through its wholly-owned subsidiary, TSMC Global Ltd., has raised an aggregate amount of US$3 billion from the issuance of a three-tranche notes offering, consisting of US$1 billion 0.750% Notes due 2025, US$750 million 1.000% Notes due 2027, and US$1.25 billion 1.375% Notes due 2030. TSMC, a multinational semiconductor contract manufacturing and design company, is currently the world’s largest dedicated foundry in the semiconductor industry. The transaction is the largest bond offering by a Taiwanese corporate to date.
Latham & Watkins LLP represented the initial purchasers in the offering with a capital markets team led by Hong Kong partners Tracy Edmonson and Benjamin Su, and Singapore counsel Monsiree Jirasarunya.