Latham & Watkins Advises Thintronics on Financing With the Department of Commerce for US$50 Million in CHIPS Incentives

Thintronics, an interconnect technology company developing next‑generation interlayer dielectric (ILD) technology for advanced semiconductor substrates, has announced it has signed a Letter of Intent (LOI) with the US Department of Commerce and the CHIPS Research and Development Office (CRDO) for up to US$50 million in CHIPS incentives under the CHIPS and Science Act. The proposed incentives are expected to accelerate commercialization of Thintronics' ultra‑low‑loss substrate ILD platform, enabling the next generation of AI, high‑performance computing, advanced networking, and chiplet‑based semiconductor packaging.

Latham & Watkins LLP is representing Thintronics in the transaction with a corporate team led by partners David Zaheer and Haim Zaltzman, with associate Dylan Towns. Advice was also provided on intellectual property matters by partner Morgan Brubaker; on government contracts matters by partner Kyle Jefcoat; and on finance matters by partner Bryan Monson.